You are currently viewing The Future is Glass – IT Connection

The Future is Glass – IT Connection


S. Schuchart

Abstract Bullets:

• The physics limits of copper are looming within the subsequent few technology of microprocessors

• Silicon photonics represents a attainable answer for interconnections inside and out of doors the chip

The long run is glass, and it’s not simply meant to be a play on the outdated crystal ball. Properly, possibly not *strictly* glass however it’s with silicon photonics. Fiber optics are confirmed and efficient in knowledge communications. Between use circumstances similar to metro rings, any Ethernet past 10GbE or needing greater than a 300 meter distance, and extra just lately a push to deliver fiber optic communications to the house. Fiber optics doesn’t have most of the drawbacks that good outdated copper has, and there are nonetheless new analysis methods to make enhancements to generally deployed fiber optic cable.

The place the place optics are actually going to make a distinction is on the chip stage. Silicon photonics, because the title implies, is using silicon as a provider for optical indicators. This system to create silicon photonics is basically the identical as it’s for many silicon chip fabrication. This permits for silicon photonics for use each internally and externally on a chip. However why do we’d like such a factor? Properly, with the shrinking of die sizes in silicon, and the ever-present want for extra and quicker communications actually are a few of the drivers. Using commonplace copper interconnects is changing into increasingly troublesome; they’re merely hitting physics restrict of copper interconnect.

There are different areas with the identical concern, significantly on server boards and different high-speed processing gear. The necessity for inter-chip communications amongst a number of CPUs, GPUs, and different chips has grown exponentially with the expansion of processor energy and knowledge utilization. These interconnects have gotten more and more troublesome to make. Electromagnetic crosstalk, and reliability points with copper will probably imply that copper will see its finish after 2 nanometer die sizes are achieved. There are a number of different rarer metals which may be substituted in subsequent generations of silicon chips, however in the long term silicon photonics appears to be the best way ahead.

Firms similar to IBM, Cisco, Intel and AMD are all researching silicon photonics, in addition to main universities around the globe. Funding within the know-how is ongoing and whereas silicon photonics is promising, there are nonetheless limitations to beat earlier than widespread industrial adoption shall be attainable. Within the meantime, it’s a know-how that deserves appreciable consideration.

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